聚酰亚胺薄膜层叠体热处理过程中的结构演变The Structure Evolution of PI Sheaf During Heat Treatment
李海英,高晓晴,张国兵,郭全贵,刘朗
摘要(Abstract)：
将双向拉伸PI薄膜,层叠后经800℃炭化所得样品在热压机中进行从2 500℃到2 800℃的高温石墨化处理制得了高定向石墨材料。借助SEM、XRD、四探针法等测试手段分析了PI薄膜层叠成型体在热处理过程中尺寸、传导性能、微观结构等的变化。结果表明石墨化处理后,样品径向增大,厚度减小;2 800℃处理后材料层间距接近单晶石墨的理论层间距,表现出了较高的石墨化程度,且具有高的取向性和传导性能,根据电阻率与热导率的相关公式推得其热导率为1 000 W/(m.K)～1600 W/(m.K).在整个热处理过程中,所生成的物质继承了原料分子的取向性。
关键词(KeyWords)： 聚酰亚胺薄膜;热处理;结构演变
基金项目(Foundation):
作者(Author): 李海英,高晓晴,张国兵,郭全贵,刘朗
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